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GUC Show World’s First HBM3 PHY, Controller, and CoWoS Platform at 7.2 Gbps

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International Unichip Corp. (GUC), the chief in Superior ASIC, introduced that they’ve silicon accessible which proved their 7.2 Gbps HBM3 answer, utilizing SK hynix’s first accessible HBM3 samples. The platform was demonstrated on the Associate Pavilion of the TSMC 2022 North America Expertise Symposium; it contained an HBM3 Controller, a PHY, GLink-2.5D die-to-die interface, and a 112G SerDes. The platform helps each the TSMC CoWoS-S (silicon Interposer) and the CoWoS-R (natural interposer) superior packaging applied sciences.

The platform represents real-world CPU/GPU/AI/Networking chips by integrating a number of HBM3 recollections, GLink-2.5D die-to-die interfaces, and 112G-LR lanes in a excessive energy (as much as 400 W) SoC. GUC designed the SoC chip, interposer, substrate and DFT to fulfill excessive energy and excessive pace requirement on the system stage; managed the consigned supplies and last testing with intensive operation expertise; and labored with TSMC on CoWoS package deal meeting.

The HBM3 PHY and Controller IP are prepared for top yield manufacturing at 7.2 Gbps. GUC’s patent-pending interposer design permits HBM3 bus routing between PHY and reminiscence at any angle whereas protecting the identical sign high quality as in common straight HBM bus routing. It additionally gives a excessive flexibility for the SoC and interposer floorplan. GUC’s patented answer permits a reminiscence bus of 1 HBM3 die to be cut up into two Controller/PHY pairs in two separate SoC dies. This distinctive function permits the configuration of two:6 or 2:10 SoC vs. HBM3 use circumstances.

SK hynix’s HBM3 – used for GUC’s Controller, PHY, and platform – gives as much as 819 GB/s of bandwidth. “Lately we began mass manufacturing of HBM3 and are proving the world’s first readiness of HBM3 and its finest efficiency.” mentioned Sungsoo Ryu, head of DRAM product planning at SK hynix, “By this cooperation, SK hynix and GUC had been in a position to affirm their partnership inside the HBM ecosystem. We recognize this collaboration as a chance to show the world’s finest HBM3 answer and solidify our management within the premium DRAM market.”

“We’re proud, along with TSMC and SK hynix, to reveal a first-in-the-industry HBM3 answer. Our HBM3 Controller and PHY are primarily based on the very long time and high-volume manufacturing expertise of GUC’s CoWoS/HBM2 merchandise. At 7.2 Gbps we’re prepared for the ever-growing pace necessities of our prospects.”, mentioned Jentai Hsu, vp of GUC. “GUC has a novel mixture of HBM3, GLink-2.5D and GLink-3D IP portfolio, CoWoS, InFO_oS, 3DIC design experience, package deal design, electrical and thermal simulations, DFT and manufacturing testing, excessive quantity manufacturing expertise to allow quick growth, and fast manufacturing ramp-up of the best finish CPU/GPU/AI/Networking merchandise.”


Key options of GUC’s HBM3 CoWoS Platform:

  • World’s 1st absolutely useful HBM3 Controller and PHY, production-ready at 7.2 Gbps
  • CoWoS interposer and package deal meet tight 112G-LR SerDes necessities
  • GLink-2.5D interface connecting a number of dies over CoWoS
  • GUC’s patent-pending interposer routing to assist HBM3 bus routing at any angle
  • Helps each TSMC’s CoWoS-S and CoWoS-R applied sciences

GUC 7.2 Gbps HBM3 Resolution Utilizing SK hynix’s First Accessible HBM3 Samples

To be taught extra about GUC’s HBM3/2E, GLink-2.5D/3D IP portfolio and InFO/CoWoS/3DIC complete answer, please contact your GUC gross sales consultant immediately or ship electronic mail to

Please go to


About GUC

GLOBAL UNICHIP CORP. (GUC) is the Superior ASIC Chief who gives the semiconductor {industry} with main IC implementation and SoC manufacturing providers, utilizing superior course of and packaging expertise. Primarily based in Hsinchu, Taiwan, GUC has developed a worldwide status with a presence in China, Europe, Japan, Korea, and North America. GUC is publicly traded on the Taiwan Inventory Change underneath the image 3443. For extra info, go to




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